PET release film

This versatile release film is perfectly suited for the production of multilayer printed circuit boards, flexible circuits, and insulating materials.Its release properties surpass most synthetic materials, such as epoxy, melamine, and phenolic resins, while also boasting high elasticity and tensile strength.The film is ideal for moulding under pressure up to 210 °C and is coated on both sides with an inorganic silicon compound, while maintaining its release properties.

In stock

Thickness: 25 and 36 microns
Dimensions: cut to customer requirements

Properties:

Usable at forming temperatures up to 210 °C
Minimal shrinkage, no creases or warping
Has a smoothing effect on the surface, suitable for embedding raised structures
Low storage requirements (from –30 to +30 °C)
Also suitable for high-pressure laminate processes up to 150 bar (1500 N/cm²)
Can be formed in contact with aluminium, steel plates, press films or printing pads made of cellulose or cotton
Free from inclusions, bubbles or micro pinholes